⚡ PMIC High-Voltage Race: Market Set for $44.7B in 2026.
AI, automotive electrification, and data centers are driving 8.4% YoY growth. As AI chip power consumption passes 1kW, PMICs are becoming the core of intelligent power management, focused on IVR/PIVR, 800VDC, and digital telemetry. Global leaders and Asian suppliers are speeding up work on full-stack power platforms.
Map the PMIC supplier race 👉 buff.ly/pW5hihJ
Explore the US data center power gap 📖 buff.ly/YawFi6O
#TrendForce #SelectedTopics
#Apple’s foldable #iPhoneDuo reportedly faces hinge issues, yet its 12-month shipment target is reportedly up 44% to 14M units, reflecting strong demand and extra stockpiling against assembly defects.💡More: buff.ly/gTQicPw 🔗
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#AppliedMaterials is doubling down on #hybridbonding, planning to raise its stake in #BESI from 9% to 20%. The Dutch firm reportedly holds around 70% of the global hybrid bonding equipment market.💡More: pse.is/9t3ya2 🔗
#SKhynix had originally planned to list its subsidiary #Solidigm on the Nasdaq, with market expectations pointing to a roughly 10% stake sale and proceeds of approximately $15 billion. However, investors and stakeholders raised concerns as the listing would reduce SK hynix’s ownership of Solidigm and dilute the subsidiary’s contribution to the parent company’s earnings by around 10%.
#TrendForce notes that Solidigm’s production is concentrated on 1XXL and 2XXL NAND nodes, with a focus on high-capacity QLC products. While the company has benefited from AI-driven supply shortages and price increases, its future performance could become more volatile as #YMTC expands production and Solidigm faces limited competitive advantages in high-end, high-speed SSDs. TrendForce believes SK hynix’s decision to postpone the IPO is primarily intended to avoid a potential drag on the parent company’s valuation should Solidigm’s performance weaken after listing. Keeping Solidigm within the group also allows SK hynix to retain the subsidiary’s current earnings contributions.
Turmoil hits AI buildout as neoclouds face pressure, credit risks mount and Solidigm pulls IPO cnbc.com/2026/10/23/ai-turmo…
Is #NVIDIA easing the HBM pressure? Beyond rethinking Rubin Ultra’s memory mix, the chipmaker has quietly cut Rubin GPU’s HBM4 bandwidth by nearly 13%.
A shift by one of the world’s biggest HBM buyers could ripple across the memory market. #NVIDIA is reportedly reconsidering 12-Hi HBM4E for Rubin Ultra in favor of a mix of 8-Hi #HBM4 and HBM4E, potentially easing costs and supply constraints.💡More: pse.is/9t3m77 🔗
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🚀 #MicroLED optical interconnects are gaining traction in AI infrastructure! U.S. smart glasses maker Vuzix showcased its Causeway waveguide platform at OCP, supporting Micro LED and VCSEL light sources for high-density optical connections.💡More: pse.is/9t3ded 🔗
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Another price hike in the works? #TSMC is reportedly eyeing a 20% jump in #CoWoS prices, on top of planned foundry price increases, as AI GPUs, server CPUs, and custom ASICs fuel a fresh surge in advanced packaging demand.💡More: pse.is/9t2595 🔗
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A new breakthrough in fourth-generation semiconductors? China’s Jiachi Power Technology claims a world-first vertical gallium oxide MOSFET, delivering over 1 A of on-state current and 900 V breakdown voltage—setting multiple performance records.💡More: pse.is/9szvlw 🔗
NVIDIA is moving to secure more substrate capacity.
ABF lead times remain Very Tight at 48–56 weeks vs. 12 weeks in a balanced market, while NVIDIA plans to increase substrate capacity for its products by 2.5x over the next three years. (1/2)
Memory is another key theme this week.
Micron is targeting vHBM mass production and HBM5 in 2028, while SK hynix, Samsung, and CXMT report this week—with HBM4 ramps, pricing, and LTAs among the key watch points.
Full read: Weekly Radar 007
insights.trendforce.com/p/we… 🔗 (2/2)
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A 2,330% profit surge! Chinese #SiC firm SICC, a rival to global players like Wolfspeed, saw net profit jump to CNY 27.22M in 9M26, fueled by demand for automotive-grade conductive substrates as EV makers accelerate the shift to 800V platforms.💡More: pse.is/9sxxka 🔗
Industry forecasts point to a massive 3Q26 for #SKhynix: sales +300% and OP +576% YoY. Can #HBM4 deliver the next surprise? DRAM/NAND ASP growth and LTA updates are also in focus.
With Samsung projecting a nearly 800% YoY surge in 3Q26 operating profit to KRW 107T, all eyes are on #SKhynix, whose earnings are tipped to approach a record KRW 77T. But can its #HBM4 ramp-up meet expectations and deliver the next profit boost?💡More: pse.is/9subuw 🔗
Micron accelerates its AI memory roadmap.
📰 News Source: buff.ly/5AR5aRx
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#Micron says #AI cut data center #SSD controller design time by 50% and product development time by 60% vs. the prior generation, and plans $10B over the next decade for Micron Research Labs, its first dedicated U.S. memory research hub. 💡More: pse.is/9s8w97 🔗 $MU
Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports.
📰 News Source: buff.ly/K9khqpF
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#Intel CTO Pushkar Ranade said on the Dwarkesh Podcast that Intel has already caught up with #TSMC if the measure is #technology alone, while scale will take longer; global tools allow roughly 2x more leading-edge output, not 10x.💡More: trendforce.com/news/ 🔗 $INTC $TSM
TrendForce retweeted
#Micron targets 2028 for #vHBM, which stacks #HBM directly on processors, with vHBM 1/2/3 slated for 2028/29/30 alongside HBM5/5E/6. HBM4 delivers 2.8 TB/s per stack, and vEIM 1 aims for 2 TB/s at under 1 pJ/bit. 💡More: pse.is/9s8w97 🔗 $MU
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#Amazon says #AWS large-scale compute capacity is fully booked for 2026, most of 2027 is sold out and a considerable share of 2028 is committed; CEO Andy Jassy does not expect #Memory and power shortages to end in 2027.💡More: trendforce.com/news/ 🔗 $AMZN













